Mehdi Asheghi

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Nanoscale thermal transport phenomenon in the emerging data storage and semiconductor technologies. The current research involves cross-disciplinary collaborations between the Mechanical and Electrical Engineering Departments as well as several industry partners (Intel Corp., Ovonyx, NXP etc.) on the Phase Change Random Access Memory (PCRAM) technology.

Last modified Tue, 12 Feb, 2013 at 19:51

Title Author(s) Journal Date
Thermal Engineering of Phase Change Random Access Memory (PCRAM) Devices Asheghi, M.and Goodson K.E : Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM). 05-2008
Experimental Investigation of Nanoscale Thermal Transport in Hotspots at cryogenic temperatures Ryu, H., Klein, L. J., Asheghi, M., Hamann H Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 05-2008
Spatial Frequency Domain Heat Transfer Analysis of Hot Spot Spreading in Convectively Cooled Microprocessors Yazdani, K., and Asheghi, M Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM). 05-2008
Thermal Analyses of Confined Cell Design for Phase Change Random Access Memory (PCRAM Small, E., Sadeghipour, S. M., Pileggi, L. and Asheghi, M. Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM). 05-2008

NSF NIRT, 2001-2005 Phonon Transport in Nanostructures with Application to Ultra-thin SOI Transistors. NSF TTTP, 2006-2008 Giant MagnetoThermal Resistance (GMTR) Phenomena. NSF TTTP, 2009-1012 "Nanosacle Thermal Characterizations of Chalcogenide Phase-Change (PC) Nanoengineered Materials."